Title :
Predicting printability of WSPs through rheological characterization
Author :
Carpenter, Burt ; Pearsall, Kitty ; Raines, Robert
Author_Institution :
Advanced Workstations & Syst., IBM Corp., Austin, TX, USA
Abstract :
Water soluble fluxes and pastes contain a high percentage of free acids that increase the activation level and subsequently enhance solderability, but do not contain resins. A method was developed that can be used to predict the printability of a water soluble solder paste. Since a solder paste shear thins and exhibits a yield point during actual printing (paste flow) these two parameters were measured and then correlated to the resultant paste print performance on more than 40 different lots of paste. The measurement techniques used for the in-depth rheological characterization as well as the viscometers employed are discussed in detail
Keywords :
rheology; soldering; stress measurement; surface mount technology; viscometers; viscosity measurement; yield stress; SMT; measurement techniques; paste flow; paste print performance; printability; rheological characterization; viscometers; viscosity measurement; water soluble solder paste; yield point; yield stress measurement; Geometry; Performance evaluation; Printing; Resins; Rheology; Shape; Soldering; Stress; Viscosity; Workstations;
Conference_Titel :
Electronic Components and Technology Conference, 1994. Proceedings., 44th
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-0914-6
DOI :
10.1109/ECTC.1994.367492
