Title :
Bending and twisting of 96.5Sn3.5Ag and 97.5Pb2.5Sn solder interconnects with creep
Author_Institution :
Hewlett-Packard Co., Palo Alto, CA, USA
Abstract :
An exact analysis is presented for the creep deformation of a thin-walled circular solder cylinder under the simultaneous actions of bending and twisting moments. Dimensionless interaction curves and charts which relate the variables, interconnect geometry, solder material properties, bending moment, twisting moment, curvature rate, and twist rate are also provided for engineering practice convenience. The constitutive relationship of the 97.5Pb2.5Sn and 96.5Sn3.5Ag solder interconnects is described by the Garofalo-Arrhenius steady-state creep equation
Keywords :
bending; creep; lead alloys; silver alloys; soldering; tin alloys; Garofalo-Arrhenius steady-state creep equation; Pb97.5Sn2.5; Sn96.5Ag3.5; bending moment; creep deformation; curvature rate; dimensionless interaction curves; interconnect geometry; solder interconnects; solder material properties; thin-walled circular solder cylinder; twist rate; twisting moment; Capacitive sensors; Creep; Engine cylinders; Equations; Milling machines; Steady-state; Temperature dependence; Tensile stress; Thin wall structures; Uniaxial strain;
Conference_Titel :
Electronic Components and Technology Conference, 1994. Proceedings., 44th
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-0914-6
DOI :
10.1109/ECTC.1994.367493
