Title :
Analysis and optimization of the dynamic response of a rectangular plate to a shock load acting on its support contour, with application to portable electronic packages
Author :
Suhir, E. ; Burke, R.
Author_Institution :
AT&T Bell Labs., Murray Hill, NJ, USA
Abstract :
The authorse examine the dynamic response of an element having a shape of a rectangular plate (e.g. liquid crystal display) and packaged in a “double box” system (e.g. a “chassis” and a “cabinet”). The analysis is carried out, assuming that the outer box (“cabinet”) does not rebound. The purpose of the analysis is to evaluate the effect of the masses (weights) of the element itself and the inner box (“chassis”), as well as the effect of the spring constants of the cushionings, on the maximum displacement and the maximum acceleration of the plate´s support contour. On the basis of the performed analysis, they developed engineering guidelines for the preliminary selection of the spring constants of the cushionings, so that not to compromise the dynamic stability of the package (e.g. to keep the induced displacements and accelerations at a sufficiently low level). They show that this stability can be ensured by designing the package in such a way that the lower natural frequency of vibrations of the two-degree-of-freedom dynamic system in question (plate/chassis assembly) differs considerably from its higher frequency
Keywords :
circuit stability; dynamic response; liquid crystal displays; packaging; vibrations; cabinet; chassis; cushioning spring constants; double box system; dynamic response; liquid crystal display; maximum acceleration; maximum displacement; natural frequency of vibrations; package dynamic stability; portable electronic packages; rectangular plate; shock load; support contour; two-degree-of-freedom dynamic system; Acceleration; Assembly systems; Frequency; Guidelines; Liquid crystal displays; Packaging; Performance analysis; Shape; Springs; Stability analysis;
Conference_Titel :
Electronic Components and Technology Conference, 1994. Proceedings., 44th
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-0914-6
DOI :
10.1109/ECTC.1994.367500