• DocumentCode
    2375995
  • Title

    Building of silicon mechanical sensors by bulk micromachining and anodic bonding

  • Author

    Lpadatu, D. ; Jakobsen, Henrik

  • Author_Institution
    SensoNor asa, Horten, Norway
  • Volume
    1
  • fYear
    1998
  • fDate
    6-10 Oct 1998
  • Firstpage
    33
  • Abstract
    This paper deals with some industrial aspects of microsensor technology and the approach taken by SensoNor in building silicon mechanical sensors. The paper gives a review of the two major technological tools employed in the fabrication of silicon mechanical sensors, micromachining and anodic bonding. To demonstrate the strength of the proven technology, several examples of feasible, low cost, highly reliable sensors are presented
  • Keywords
    anodisation; elemental semiconductors; micromachining; microsensors; silicon; wafer bonding; Si; anodic bonding; bulk micromachining; fabrication; microsensor technology; silicon mechanical sensor; Bonding; Consumer electronics; Costs; Electrostatic actuators; Fabrication; Mechanical sensors; Micromachining; Micromechanical devices; Silicon; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Conference, 1998. CAS '98 Proceedings. 1998 International
  • Conference_Location
    Sinaia
  • Print_ISBN
    0-7803-4432-4
  • Type

    conf

  • DOI
    10.1109/SMICND.1998.732269
  • Filename
    732269