DocumentCode
2375995
Title
Building of silicon mechanical sensors by bulk micromachining and anodic bonding
Author
Lpadatu, D. ; Jakobsen, Henrik
Author_Institution
SensoNor asa, Horten, Norway
Volume
1
fYear
1998
fDate
6-10 Oct 1998
Firstpage
33
Abstract
This paper deals with some industrial aspects of microsensor technology and the approach taken by SensoNor in building silicon mechanical sensors. The paper gives a review of the two major technological tools employed in the fabrication of silicon mechanical sensors, micromachining and anodic bonding. To demonstrate the strength of the proven technology, several examples of feasible, low cost, highly reliable sensors are presented
Keywords
anodisation; elemental semiconductors; micromachining; microsensors; silicon; wafer bonding; Si; anodic bonding; bulk micromachining; fabrication; microsensor technology; silicon mechanical sensor; Bonding; Consumer electronics; Costs; Electrostatic actuators; Fabrication; Mechanical sensors; Micromachining; Micromechanical devices; Silicon; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Conference, 1998. CAS '98 Proceedings. 1998 International
Conference_Location
Sinaia
Print_ISBN
0-7803-4432-4
Type
conf
DOI
10.1109/SMICND.1998.732269
Filename
732269
Link To Document