• DocumentCode
    237603
  • Title

    Multistage semiconductor memory inventory model based on survival analysis

  • Author

    Jei-Zheng Wu ; Chen-Fu Chien ; Yi-Chi Tsou

  • Author_Institution
    Dept. of Bus. Adm., Soochow Univ., Taipei, Taiwan
  • fYear
    2014
  • fDate
    18-22 Aug. 2014
  • Firstpage
    613
  • Lastpage
    618
  • Abstract
    Inventory management is challenging and critical problem in the semiconductor memory manufacturing industry. Rapid technological development and short product life cycle cause a high risk of product obsolescence. However, manufacturers must still hold a reasonable level of inventory to satisfy the needs of customers when demand is uncertain and lead times are long. In this study, the needs and constraints of this semiconductor manufacturing problem based on inventory days were considered and a linear programming model was constructed with the objective of determining a weighted minimal cost for resolving the problem of multistage inventory management. This study applied the concept of material requirement planning for calculating the inventory information of various stages. In addition, the shortage problem, excessive or inadequate safety stock levels, and capacity balance of technology were considered. Finally, a numerical study was conducted for evaluating the performance of the inventory model, and the results showed that the model can assist decision makers in early preparation of inventories. Under the same condition of demand fulfillment, the proposed model can be used to reduce the unnecessary inventory of downstream banks and avoid the risk of future inventory obsolescence, thereby enhancing competitiveness.
  • Keywords
    inventory management; linear programming; materials requirements planning; semiconductor industry; customer need satisfaction; inventory management; linear programming; material requirement planning; semiconductor memory manufacturing industry; survival analysis; Equations; Manufacturing; Materials requirements planning; Mathematical model; Safety; Semiconductor device modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Automation Science and Engineering (CASE), 2014 IEEE International Conference on
  • Conference_Location
    Taipei
  • Type

    conf

  • DOI
    10.1109/CoASE.2014.6899391
  • Filename
    6899391