Development of environmentally preferred plastic ball grid array, PBGA, components

Author

Matsuda, Yuuki

Author_Institution

Semicond. Products Sector, Motorola Japan Ltd, Tokyo

fYear

2001

fDate

2001

Firstpage

946

Lastpage

951

Abstract

The movement of the market to environmentally improved components is being driven by proposed legislation in Europe and Japan. Many corporations in Japan have publicly stated their intentions to convert to no-Pb solders and components in the next 2 to 3 years. The restriction of halogenated compounds is also expected in the coming years. This paper will document the activities of a cross functional team formed within Motorola to develop the materials and processes to produce Pb (lead) free and halogen free PBGA (plastic ball grid array) packages for the assembly of integrated circuits to circuit boards using Pb free solder paste. Results of component and board level reliability experiments are presented

Keywords

ball grid arrays; circuit reliability; environmental factors; legislation; plastic packaging; printed circuit manufacture; soldering; Motorola; PBGA; board level reliability; component reliability; environmentally improved components; halogen free compounds; lead-free solders; legislation; plastic ball grid array; solder paste; Assembly; Electronic waste; Electronics packaging; Lead; Plastics; Printed circuits; Semiconductor materials; Soldering; Temperature sensors; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Environmentally Conscious Design and Inverse Manufacturing, 2001. Proceedings EcoDesign 2001: Second International Symposium on

Conference_Location

Tokyo

Print_ISBN

0-7695-1266-6

Type

conf

DOI

10.1109/.2001.992499

Filename

992499