Fine line thin dielectric circuit board characterization

Author

Chang, Chi Shih ; Agrawal, Amit P.

Author_Institution

Microelectron. Div., IBM Corp., Endicott, NY, USA

fYear

1994

fDate

1-4 May 1994

Firstpage

564

Lastpage

569

Abstract

The rough surface of the copper foil, introduced to enhance its interfacial adhesion to the dielectric medium, will increase the signal propagation time constant and reduce the characteristic impedance. A high resolution resonant measurement technique will be presented for such study. The internal inductance will increase both the propagation time constant and the characteristic impedance. It adds an additional delay term, proportional to the square root of the signal rise time in the transient measurement. We will compare the results of different measurement techniques in this paper

Keywords

copper; dielectric materials; printed circuits; surface topography; transient analysis; Cu; characteristic impedance; copper foil; delay; dielectric medium; fine line thin dielectric circuit board; high resolution resonant measurement; interfacial adhesion; internal inductance; rough surface; signal propagation time constant; signal rise time; transient measurement; Adhesives; Copper; Dielectrics; Measurement techniques; Printed circuits; Resonance; Rough surfaces; Signal resolution; Surface impedance; Surface roughness;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1994. Proceedings., 44th

Conference_Location

Washington, DC

Print_ISBN

0-7803-0914-6

Type

conf

DOI

10.1109/ECTC.1994.367537

Filename

367537