DocumentCode
2376654
Title
JIEP project for low-temperature lead-free solders and its report on questionnaire survey
Author
Suga, Tadatomo ; Takeuchi, Makoto
Author_Institution
Univ. of Tokyo, Japan
fYear
2001
fDate
2001
Firstpage
1050
Lastpage
1054
Abstract
The Japan Institute for Electronic Packaging (JIEP) has been carrying out a research project investigating low-temperature lead-free solders. This report describes the background of the project and the results of a questionnaire to companies dealing with lead-free soldering. The questionnaire elicits present points of view of Japanese manufacturers on low-temperature lead-free solders
Keywords
circuit reliability; low-temperature techniques; packaging; reflow soldering; JIEP; Japanese manufacturers; low temperature lead-free solders; packaging; questionnaire; reflow; reliability; Electronic equipment manufacture; Electronic waste; Electronics packaging; Environmentally friendly manufacturing techniques; Joining processes; Lead; Manufacturing industries; Manufacturing processes; Soldering; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Environmentally Conscious Design and Inverse Manufacturing, 2001. Proceedings EcoDesign 2001: Second International Symposium on
Conference_Location
Tokyo
Print_ISBN
0-7695-1266-6
Type
conf
DOI
10.1109/.2001.992520
Filename
992520
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