Title :
Fault tuples in diagnosis of deep-submicron circuits
Author :
Blanton, R.D. ; Chen, J.T. ; Desineni, R. ; Dwarakanath, K.N. ; Maly, W. ; Vogels, T.J.
Author_Institution :
Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Abstract :
Diagnosis of malfunctioning deep-submicron (DSM) ICs is becoming more difficult due to the increasing sophistication of the manufacturing process and the structural complexity of the IC itself. At the same time, key diagnostic tasks that include defect localization are still solved using primitive models of the IC\´s defects. This paper explores the use of "fault tuples" in diagnosis. Fault tuples can accurately mimic the complex misbehavior of DSM ICs at the logic level, enabling practical diagnosis of large circuits. Initial assessment of the use of fault tuples in diagnosis is performed based on a case study involving one specific category of polysilicon spot defects. Obtained results indicate that fault tuples may enhance diagnosis significantly.
Keywords :
circuit complexity; failure analysis; fault location; integrated circuit modelling; integrated circuit reliability; integrated circuit testing; logic testing; IC defect models; IC structural complexity; Si; complex logic level IC misbehavior; deep-sub-micron IC diagnosis; defect localization; diagnostic tasks; failure analysis; fault characterization; fault model; fault tuples; fault tuples-enhanced diagnosis; malfunctioning IC; manufacturing process; polysilicon spot defects; Cause effect analysis; Circuit faults; Computer aided manufacturing; Delay; Fault diagnosis; Integrated circuit modeling; Performance analysis; Silicon; Testing; Virtual manufacturing;
Conference_Titel :
Test Conference, 2002. Proceedings. International
Print_ISBN :
0-7803-7542-4
DOI :
10.1109/TEST.2002.1041765