DocumentCode
2377058
Title
Fault tuples in diagnosis of deep-submicron circuits
Author
Blanton, R.D. ; Chen, J.T. ; Desineni, R. ; Dwarakanath, K.N. ; Maly, W. ; Vogels, T.J.
Author_Institution
Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
fYear
2002
fDate
2002
Firstpage
233
Lastpage
241
Abstract
Diagnosis of malfunctioning deep-submicron (DSM) ICs is becoming more difficult due to the increasing sophistication of the manufacturing process and the structural complexity of the IC itself. At the same time, key diagnostic tasks that include defect localization are still solved using primitive models of the IC\´s defects. This paper explores the use of "fault tuples" in diagnosis. Fault tuples can accurately mimic the complex misbehavior of DSM ICs at the logic level, enabling practical diagnosis of large circuits. Initial assessment of the use of fault tuples in diagnosis is performed based on a case study involving one specific category of polysilicon spot defects. Obtained results indicate that fault tuples may enhance diagnosis significantly.
Keywords
circuit complexity; failure analysis; fault location; integrated circuit modelling; integrated circuit reliability; integrated circuit testing; logic testing; IC defect models; IC structural complexity; Si; complex logic level IC misbehavior; deep-sub-micron IC diagnosis; defect localization; diagnostic tasks; failure analysis; fault characterization; fault model; fault tuples; fault tuples-enhanced diagnosis; malfunctioning IC; manufacturing process; polysilicon spot defects; Cause effect analysis; Circuit faults; Computer aided manufacturing; Delay; Fault diagnosis; Integrated circuit modeling; Performance analysis; Silicon; Testing; Virtual manufacturing;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 2002. Proceedings. International
ISSN
1089-3539
Print_ISBN
0-7803-7542-4
Type
conf
DOI
10.1109/TEST.2002.1041765
Filename
1041765
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