Title :
Low cost fiber in the loop (FITL) laser modules
Author_Institution :
Solid State Technol. Center, AT&T Bell Labs., Breinigsville, PA, USA
Abstract :
This paper reviews the challenges associated with the design and assembly of low cost, fiber in the loop (FITL) laser modules. The implementation of fiber in the subscriber loop requires low cost, reliable packaging of semiconductor lasers into laser modules. The laser module provides a means of coupling photons from the laser into an optical fiber which requires alignments with stringent micron level tolerances. These alignments must remain stable over the severe loop environment, including temperature conditions from -40°C to +85°C, for the lifetime of the module. The design of the laser module must also satisfy mechanical, thermal, and electrical constraints. All these issues must be addressed while balancing the design between performance and cost, with low cost being the major driver for FITL applications
Keywords :
optical fibre couplers; optical fibre subscriber loops; semiconductor device packaging; semiconductor lasers; -40 to 85 degC; FITL laser modules; cost; electrical constraints; fiber in the loop; mechanical constraints; micron level tolerances; optical fiber coupling; packaging; semiconductor lasers; subscriber loop; temperature conditions; thermal constraints; Assembly; Costs; Fiber lasers; Optical coupling; Optical design; Optical fiber subscriber loops; Semiconductor device packaging; Semiconductor device reliability; Semiconductor lasers; Subscriber loops;
Conference_Titel :
Electronic Components and Technology Conference, 1994. Proceedings., 44th
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-0914-6
DOI :
10.1109/ECTC.1994.367573