Title :
24 GHz LTCC Amplifier Using Packaged HEMTs
Author :
Napijalo, Veljko ; Cojocaru, Vicentiu ; Yokoyama, Takeshi
Author_Institution :
TDK Electron. Ireland, Dublin
Abstract :
The design of an LTCC self-packaged amplifier for the 24 GHz ISM band using packaged transistors is described. The amplifier utilizes to a full extent the benefits of the multilayer environment as all matching networks are realized by employing multilayer impedance transformers. Advantages of using such transformers are the elimination of dedicated DC blocks, flexible layout routing and a milder discontinuity in the vertical transitions towards the PCB connection. A combination of on-tile and off-tile distributed matching has been implemented allowing for the amplifier to be used on various PCB substrate materials. The amplifier can be used in both the receiver and transmitter chains, in various application scenarios. Examples of the measured amplifier characteristics designed on two different substrate materials are shown, illustrating the trade-off between the cost and the performance of the materials used.
Keywords :
high electron mobility transistors; microwave amplifiers; printed circuits; ISM band; LTCC amplifier; PCB substrate materials; frequency 24 GHz; multilayer impedance transformers; off-tile distributed matching; on-tile distributed matching; packaged HEMT; packaged transistors; receiver chains; transmitter chains; Costs; Distributed amplifiers; HEMTs; Impedance; MODFETs; Nonhomogeneous media; Packaging; Routing; Transformers; Transmitters;
Conference_Titel :
Microwave Conference, 2008. EuMC 2008. 38th European
Conference_Location :
Amsterdam
Print_ISBN :
978-2-87487-006-4
DOI :
10.1109/EUMC.2008.4751749
