• DocumentCode
    2377485
  • Title

    Thermoelectric and heat-transfer properties in a new-type module composed of hamburger-type elements

  • Author

    Tanji, Y. ; Nakagawa, Y. ; Moriya, S. ; Niino, M. ; Yasuoka, M. ; Sato, R. ; Tada, Y.

  • Author_Institution
    Nat. Aerosp. Lab., Kakuda, Japan
  • fYear
    1997
  • fDate
    26-29 Aug 1997
  • Firstpage
    578
  • Lastpage
    581
  • Abstract
    We have proposed the use of hamburger-type thermoelectric elements for a new-type module assembled by screwing. In the present work, the new-type module is manufactured and tested. The thermoelectric materials used are quasi-single crystals of (Bi,Sb)2(Te,Se)3. The maximum electric power of the test module of 5.8×5.8×2.9 cm3 in size at the temperature difference of 86°C between end surfaces of thermoelectric material disks amounts to 1.14 W with the current of 4.55 A. The ratio of electrical contact resistance to the total resistance of thermoelectric material disks is unexpectedly large, caused by the unfit soldering between thermoelectric material disks and copper blocks composing the hamburger-type thermoelectric elements. The contact resistance between the metallic parts is reduced by spreading metallic paste composed of the two-phase structure of liquid InGa+solid Zn
  • Keywords
    contact resistance; heat transfer; thermoelectric conversion; thermoelectric devices; (Bi,Sb)2(Te,Se)3; (BiSb)2(TeSe)3; 1.14 W; 2.9 cm; 4.55 A; 5.8 cm; InGa-Zn; copper blocks; electric power; electrical contact resistance ratio; end surfaces; hamburger-type elements; heat-transfer properties; liquid InGa+solid Zn; metallic paste; quasi-single crystals; soldering; thermoelectric material disks; thermoelectric properties; two-phase structure; Assembly; Contact resistance; Crystalline materials; Crystals; Electric resistance; Manufacturing; Surface resistance; Testing; Thermal resistance; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 1997. Proceedings ICT '97. XVI International Conference on
  • Conference_Location
    Dresden
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-4057-4
  • Type

    conf

  • DOI
    10.1109/ICT.1997.667596
  • Filename
    667596