DocumentCode
2377485
Title
Thermoelectric and heat-transfer properties in a new-type module composed of hamburger-type elements
Author
Tanji, Y. ; Nakagawa, Y. ; Moriya, S. ; Niino, M. ; Yasuoka, M. ; Sato, R. ; Tada, Y.
Author_Institution
Nat. Aerosp. Lab., Kakuda, Japan
fYear
1997
fDate
26-29 Aug 1997
Firstpage
578
Lastpage
581
Abstract
We have proposed the use of hamburger-type thermoelectric elements for a new-type module assembled by screwing. In the present work, the new-type module is manufactured and tested. The thermoelectric materials used are quasi-single crystals of (Bi,Sb)2(Te,Se)3. The maximum electric power of the test module of 5.8×5.8×2.9 cm3 in size at the temperature difference of 86°C between end surfaces of thermoelectric material disks amounts to 1.14 W with the current of 4.55 A. The ratio of electrical contact resistance to the total resistance of thermoelectric material disks is unexpectedly large, caused by the unfit soldering between thermoelectric material disks and copper blocks composing the hamburger-type thermoelectric elements. The contact resistance between the metallic parts is reduced by spreading metallic paste composed of the two-phase structure of liquid InGa+solid Zn
Keywords
contact resistance; heat transfer; thermoelectric conversion; thermoelectric devices; (Bi,Sb)2(Te,Se)3; (BiSb)2(TeSe)3; 1.14 W; 2.9 cm; 4.55 A; 5.8 cm; InGa-Zn; copper blocks; electric power; electrical contact resistance ratio; end surfaces; hamburger-type elements; heat-transfer properties; liquid InGa+solid Zn; metallic paste; quasi-single crystals; soldering; thermoelectric material disks; thermoelectric properties; two-phase structure; Assembly; Contact resistance; Crystalline materials; Crystals; Electric resistance; Manufacturing; Surface resistance; Testing; Thermal resistance; Thermoelectricity;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 1997. Proceedings ICT '97. XVI International Conference on
Conference_Location
Dresden
ISSN
1094-2734
Print_ISBN
0-7803-4057-4
Type
conf
DOI
10.1109/ICT.1997.667596
Filename
667596
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