A surface mount, thin-film, ceramic package for high-frequency wireless application

Author

Panicker, M.P.R. ; Mattei, C.J.

Author_Institution

Micro Substrates Corp., Tempe, AZ, USA

fYear

1994

fDate

1-4 May 1994

Firstpage

609

Lastpage

611

Abstract

The construction and electrical performance of a surface mount, thin-film, ceramic package are described. The package is fabricated on VIA/PLANE^TM, a ceramic substrate with hermetic tungsten-copper vias, in which the filled vias are used to form DC and 50 Ω RF ports. Vacuum-deposited, thin-film metal is photopatterned to achieve impedance control and desired electrical performance. Leads are brazed to the bottom of the substrate, directly onto the tungsten/copper vias, to form the surface mount package. Electrical performance of the package, up to 26.5 GHz, is reported. With the economics of array processing, this high-speed package is a low-cost, surface-mount alternative to co-fired technology

Keywords

MMIC; ceramics; hybrid integrated circuits; integrated circuit packaging; surface mount technology; 26.5 GHz; Al₂O₃; DC port; MMIC packaging; RF port; VIA/PLANE; W-Cu; array processing economics; ball grid array; electrical performance; hermetic W-Cu vias; high-frequency wireless; high-speed package; impedance control; lead brazing; photopatterning; reliability; surface mount thin-film ceramic package; vacuum-deposited metal; Array signal processing; Ceramics; Copper; Packaging; Radio frequency; Substrates; Surface impedance; Surface-mount technology; Transistors; Tungsten;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1994. Proceedings., 44th

Conference_Location

Washington, DC

Print_ISBN

0-7803-0914-6

Type

conf

DOI

10.1109/ECTC.1994.367612

Filename

367612