Title :
Manufacturability of capacitively coupled multichip modules
Author :
Knight, Thomas F., Jr. ; Salzman, D.B.
Author_Institution :
Artificial Intelligence Lab., MIT, Cambridge, MA, USA
Abstract :
Capacitive coupling of off-chip interconnects offers a number of advantages, including low manufacturing and repair costs, dense form factors, low power, high speed, extremely high junction pitch, and easy testing. In this paper, we review and compare the practicalities of conductive and capacitive coupling, and discuss novel issues of manufacturability and materials optimization for capacitively coupled electronic packages
Keywords :
integrated circuit interconnections; integrated circuit packaging; integrated circuit testing; multichip modules; production testing; capacitive coupling; capacitively coupled electronic packages; capacitively coupled multichip modules; conductive coupling; dense form factors; junction pitch; manufacturability; materials optimization; off-chip interconnects; repair costs; testing; Capacitors; Costs; Coupling circuits; Electronics packaging; Integrated circuit interconnections; Manufacturing; Multichip modules; Optical filters; Packaging machines; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 1994. Proceedings., 44th
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-0914-6
DOI :
10.1109/ECTC.1994.367613
