DocumentCode
2377921
Title
Manufacturability of capacitively coupled multichip modules
Author
Knight, Thomas F., Jr. ; Salzman, D.B.
Author_Institution
Artificial Intelligence Lab., MIT, Cambridge, MA, USA
fYear
1994
fDate
1-4 May 1994
Firstpage
605
Lastpage
608
Abstract
Capacitive coupling of off-chip interconnects offers a number of advantages, including low manufacturing and repair costs, dense form factors, low power, high speed, extremely high junction pitch, and easy testing. In this paper, we review and compare the practicalities of conductive and capacitive coupling, and discuss novel issues of manufacturability and materials optimization for capacitively coupled electronic packages
Keywords
integrated circuit interconnections; integrated circuit packaging; integrated circuit testing; multichip modules; production testing; capacitive coupling; capacitively coupled electronic packages; capacitively coupled multichip modules; conductive coupling; dense form factors; junction pitch; manufacturability; materials optimization; off-chip interconnects; repair costs; testing; Capacitors; Costs; Coupling circuits; Electronics packaging; Integrated circuit interconnections; Manufacturing; Multichip modules; Optical filters; Packaging machines; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1994. Proceedings., 44th
Conference_Location
Washington, DC
Print_ISBN
0-7803-0914-6
Type
conf
DOI
10.1109/ECTC.1994.367613
Filename
367613
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