• DocumentCode
    2377983
  • Title

    Stretchable interconnections for flexible electronic systems

  • Author

    Jianhui, Lin ; Bing, Yan ; Xiaoming, Wu ; Tianling, Ren ; Litian, Liu

  • Author_Institution
    Tsinghua Nat. Lab. for Inf. Sci. & Technol., Tsinghua Univ., Beijing, China
  • fYear
    2009
  • fDate
    3-6 Sept. 2009
  • Firstpage
    4124
  • Lastpage
    4127
  • Abstract
    Sensors, actuators and integrated circuits (IC) can be encapsulated together on an elastic substrate, which makes a flexible electronic system. In this system, electrical interconnections that can sustain large and reversible stretching are in great need. This paper is devoted to the fabrication of highly stretchable metal interconnections. Transfer printing technology is utilized, which mainly involves the transfer of 100-nm-thick gold ribbons from silicon wafers to pre-stretched elastic substrates. After the elastic substrates relax from the pre-strain, the gold ribbons buckle and form wavy geometries. These wavy geometries change in shapes to accommodate the applied strain and can be reversely stretched without cracks or fractures occurring, which will greatly raise the stretchability of the gold ribbons. As an application example, some of these wavy ribbons can accommodate high levels of stretching (up to 100%) and bending (with curvature radius down to 1.20 mm). Moreover, the efficiency and reliability of the transfer, especially for slender ribbons, have been increased due to the improvement of the technology. All the characteristics above will permit making stretchable gold conductors as interconnections for flexible electronic systems such as implantable medical systems and smart clothes.
  • Keywords
    bending; biomedical electronics; buckling; encapsulation; flexible electronics; gold; integrated circuit interconnections; intelligent materials; reliability; Au; bending; buckling; electrical interconnections; flexible electronic systems; gold ribbons; implantable medical system applications; prestretched elastic substrates; reliability; silicon wafers; size 100 nm; smart clothes; stretchable gold conductors; stretchable metal interconnections; stretching levels; transfer printing technology; wavy geometry; Biomedical Engineering; Electric Conductivity; Electronics; Electronics, Medical; Equipment Design; Gold; Humans; Materials Testing; Metals; Microscopy, Electron, Scanning; Pressure; Silicon; Surface Properties;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
  • Conference_Location
    Minneapolis, MN
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-3296-7
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/IEMBS.2009.5332697
  • Filename
    5332697