Epoxy encapsulation on Ceramic Quad Flat Packs

Author

Carden, T. ; Clementi, J. ; Engle, S.

Author_Institution

IBM Microelectronics, Endicott, NY, USA

fYear

1994

fDate

1-4 May 1994

Firstpage

585

Lastpage

589

Abstract

The Ceramic Quad Flat Pack (CQFP) is a high performance, low cost technology for surface mount applications. It is an extension of the Metallized Ceramic (MC) and Metallized Ceramic with Polyimide (MCP) product base. These finished modules conform to JEDEC I/O and footprint standards. The packages are available in 0.5 mm and 0.4 mm lead pitches with flexibility to address unique application requirements such as body sizes or lead counts/pitches. Semiconductor die interconnection is performed using either flip chip (C4-Controlled Collapse Chip Connection) attach or wirebonding. Excellent package reliability with no intrinsic wear out failure mechanism results by encapsulating solder joints from the silicon C4 die and peripheral lead to ceramic carrier. IBM evaluated several encapsulant configurations, and tested over 2000 encapsulated carriers and 897000 individual solder joints during development and qualification. Epoxy encapsulation of solder joint connections on CQFP´s has been successfully implemented in production across several IBM manufacturing sites. This enhancement eliminates any intrinsic failure mechanism associated with fatigue wear out. It is a significant extension of a low cost and high reliability product technology

Keywords

encapsulation; flip-chip devices; integrated circuit packaging; integrated circuit reliability; lead bonding; plastic packaging; surface mount technology; 0.4 mm; 0.5 mm; CQFP; JEDEC I/O standards; body sizes; ceramic quad flat packs; controlled collapse chip connection; epoxy encapsulation; flip chip attach; footprint standards; high reliability product technology; lead pitches; package reliability; semiconductor die interconnection; solder joint connections; surface mount applications; wirebonding; Ceramics; Costs; Electronics packaging; Encapsulation; Failure analysis; Lead; Metallization; Semiconductor device packaging; Soldering; Surface-mount technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1994. Proceedings., 44th

Conference_Location

Washington, DC

Print_ISBN

0-7803-0914-6

Type

conf

DOI

10.1109/ECTC.1994.367617

Filename

367617