Thermal conductivity of molding compounds for plastic packaging

Author

Bujard, P. ; Kühnlein, G. ; Ino, S. ; Shiobara, T.

Author_Institution

Mater. Res., Ciba-Geigy SA, Basel, Switzerland

fYear

1994

fDate

1-4 May 1994

Firstpage

159

Lastpage

163

Abstract

Alumina loaded new molding compounds feature a thermal conductivity up to 4.5 W/mK, a water uptake smaller than 0.2 weight %, a coefficient of thermal expansion of 10 ppm/K and an excellent popcorn resistance (0 cracks from 6). The thermal conductivity of such particulate-loaded polymers has been investigated as a function of the volume content (0 to 80%) of aluminum oxide, quartz and fused quartz. The thermal expansion and the specific heat have also been recorded. A new model allows one to calculate the thermal conductivity and the thermal expansion within a couple percent

Keywords

filled polymers; plastic packaging; specific heat; thermal analysis; thermal conductivity; thermal expansion; Al₂O₃; CTE; SiO₂; alumina loaded molding compounds; coefficient of thermal expansion; fused quartz; model; molding compounds; particulate-loaded polymers; plastic packaging; popcorn resistance; specific heat; thermal conductivity; thermal expansion; Ceramics; Conducting materials; Electronic packaging thermal management; Epoxy resins; Plastic packaging; Polymers; Thermal conductivity; Thermal expansion; Thermal loading; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1994. Proceedings., 44th

Conference_Location

Washington, DC

Print_ISBN

0-7803-0914-6

Type

conf

DOI

10.1109/ECTC.1994.367636

Filename

367636