Probabilistic sensitivity analysis for the dynamic response of electronic systems: a study of the interactions of molding compound and die attach adhesive, with regards to package cracking

Author

Jensen, Hector A. ; Cifuentes, Arturo O.

Author_Institution

UTF Santa Maria, Valparaiso, Chile

fYear

1994

fDate

1-4 May 1994

Firstpage

107

Lastpage

114

Abstract

This paper presents a technique to study the sensitivity of the dynamic response of an electronic system as a function of some of its design parameters. In this approach the system parameters are defined in terms of some nominal value plus a deviatoric component. Different sensitivity measures for the electronic component response are characterized in terms of the statistical moments of the response or the coefficient of variation. This method is expected to be useful in the design, analysis and qualification of electronic components

Keywords

adhesion; cracks; dynamic response; packaging; probability; sensitivity analysis; deviatoric component; die attach adhesive; dynamic response; electronic component response; electronic systems; molding compound; package cracking; probabilistic sensitivity analysis; qualification; statistical moments; system parameters; Books; Damping; Electronic components; Electronic equipment testing; Electronics packaging; Manufacturing; Microassembly; Sensitivity analysis; Transportation; Uncertainty;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1994. Proceedings., 44th

Conference_Location

Washington, DC

Print_ISBN

0-7803-0914-6

Type

conf

DOI

10.1109/ECTC.1994.367643

Filename

367643