• DocumentCode
    2378467
  • Title

    Comparison of IDDQ testing and very-low voltage testing

  • Author

    Kruseman, Bram ; Van den Oetelaar, Stefan ; Rius, Josep

  • Author_Institution
    Philips Res. Lab., Eindhoven, Netherlands
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    964
  • Lastpage
    973
  • Abstract
    IDDQ testing is a well-known test method to filter dies with reliability risks. However, the test method is endangered by the increase in off-state current in advanced process technologies. An alternative for detecting resistive shorts is very-low voltage (VLV) testing. This test method tests dies at a strongly reduced supply voltage. The smaller the supply voltage, the higher the sensitivity for defects. This paper investigates if VLV testing can replace IDDQ testing. To obtain a significant increase in defect coverage, one must use a supply voltage below 2×VT. In the experiments, a supply voltage of 1.5×VT was used with relaxed timing. This makes the method more than twice as sensitive compared to 2×VT and allows one to detect shorts with resistance of five times the detection limit at the nominal supply voltage. However, even with these settings we were only capable of detecting a small fraction of the IDDQ anomalies. Therefore VLV is not suited to replace IDDQ testing.
  • Keywords
    electric current; electric potential; electric resistance; fault diagnosis; integrated circuit reliability; integrated circuit testing; timing; IDDQ anomalies; IDDQ testing; VLV testing; defect coverage; defect sensitivity; die reliability risks; nominal supply voltage; off-state current; process technologies; relaxed timing; resistance detection limit; resistive short detection; strongly reduced supply voltage tests; test method; very-low voltage testing; Boolean functions; Fault detection; Life testing; Logic devices; Logic testing; Performance evaluation; Power supplies; Routing; Semiconductor device modeling; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 2002. Proceedings. International
  • ISSN
    1089-3539
  • Print_ISBN
    0-7803-7542-4
  • Type

    conf

  • DOI
    10.1109/TEST.2002.1041852
  • Filename
    1041852