DocumentCode
2378470
Title
Fabrication and packaging of a miniature sensor array for harsh environments
Author
Dijkstra, E.A. ; Olthuis, W. ; Bomer, J.G. ; Bergveld, P. ; Kronemeijer, D.A.
Author_Institution
MESA Res. Inst., Twente Univ., Enschede, Netherlands
fYear
2001
fDate
2001
Firstpage
14
Lastpage
17
Abstract
This paper describes the fabrication of devices to be used in harsh environments. The devices should operate under extreme conditions: high temperature (180°C), high pressure (200 bar) and in a chemically aggressive environment. Therefore, packaging is a major concern. Sensor fabrication and packaging is described. Two devices were made and tested at the temperature and pressure mentioned above
Keywords
microsensors; packaging; 180 C; 200 bar; chemically aggressive environment; fabrication; harsh environment; high pressure; high temperature; miniature sensor array; packaging; Chemical sensors; Conductivity; Fabrication; Mechanical sensors; Packaging; Petroleum; Pipelines; Powders; Sensor arrays; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectromechanical Systems Conference, 2001
Conference_Location
Berkeley, CA
Print_ISBN
0-7803-7224-7
Type
conf
DOI
10.1109/MEMSC.2001.992731
Filename
992731
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