Development of a high performance TQFP package

Author

Hoffman, P. ; Liang, D. ; Mahulikar, D. ; Parthasarathi, A.

Author_Institution

Interconnect Technol., Olin Corp., New Haven, CT, USA

fYear

1994

fDate

1-4 May 1994

Firstpage

57

Lastpage

62

Abstract

A TQFP (Thin Quad Flat Pack) package has been developed that has very superior electrical and thermal performance when compared to a plastic molded TQFP package. The high performance TQFP is based on Olin´s MQUAD technology; a packaging scheme where the plastic mold compound is replaced by an anodized aluminum base and lid adhesively sealed to the leadframe. The package uses the same IR or VPR board mounting profile as a plastic package, weighs the same as a plastic package, and is dimensionally equivalent to a plastic package

Keywords

integrated circuit packaging; integrated circuit reliability; lead bonding; surface mount technology; MQUAD technology; TQFP package; adhesive seal; anodized aluminum base; board mounting profile; electrical performance; leadframe; thermal performance; thin quad flat pack; wire bonding; Aluminum; Application software; Atherosclerosis; Councils; Electron devices; Electronics packaging; Plastic packaging; Production; Seals; Semiconductor device packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1994. Proceedings., 44th

Conference_Location

Washington, DC

Print_ISBN

0-7803-0914-6

Type

conf

DOI

10.1109/ECTC.1994.367651

Filename

367651