DocumentCode
2378687
Title
Diamond microelectromechanical sensors for pressure and acceleration sensing
Author
Holmes, K.C. ; Davidson, J.L. ; Kang, W.P. ; Stemberg, A.L.
Author_Institution
Electr. Eng. & Comput. Sci., Vanderbilt Univ., Nashville, TN, USA
fYear
2001
fDate
2001
Firstpage
45
Lastpage
49
Abstract
Micro-electro-mechanical structures (MEMS) are fabricated from chemical vapor deposition (CVD) diamond films. Applying microlithographic semiconductor device fabrication process techniques, monolithic diamond piezoresistors are incorporated on a diamond substrate. This paper reviews the design and behavior of diamond MEMS (DMEMS) pressure and accelerometer sensors fabricated on the same scale as silicon devices. The sensors are designed for extreme environments where diamond´s elastic modulus, gauge factor, inertness, and high temperature semiconduction play a vital role in the sensors performance. This work garners more information as to diamond´s piezoresistive (PZR) behavior and functionality as a MEMS device
Keywords
accelerometers; chemical vapour deposition; diamond; elastic moduli; elemental semiconductors; lithography; micromachining; microsensors; piezoresistive devices; pressure sensors; resistors; C; CVD diamond films; DMEMS; MEMS; MEMS device functionality; acceleration sensing; chemical vapor deposition diamond films; diamond MEMS accelerometer sensors; diamond MEMS pressure sensors; diamond inertness; diamond microelectromechanical sensors; diamond piezoresistive behavior; diamond substrate; elastic modulus; extreme environments; gauge factor; high temperature semiconduction; micro-electro-mechanical structures; microlithographic semiconductor device fabrication process techniques; monolithic diamond piezoresistors; pressure sensing; sensor performance; Accelerometers; Chemical sensors; Chemical vapor deposition; Fabrication; Micromechanical devices; Piezoresistive devices; Semiconductor devices; Semiconductor films; Substrates; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectromechanical Systems Conference, 2001
Conference_Location
Berkeley, CA
Print_ISBN
0-7803-7224-7
Type
conf
DOI
10.1109/MEMSC.2001.992739
Filename
992739
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