• DocumentCode
    2378687
  • Title

    Diamond microelectromechanical sensors for pressure and acceleration sensing

  • Author

    Holmes, K.C. ; Davidson, J.L. ; Kang, W.P. ; Stemberg, A.L.

  • Author_Institution
    Electr. Eng. & Comput. Sci., Vanderbilt Univ., Nashville, TN, USA
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    45
  • Lastpage
    49
  • Abstract
    Micro-electro-mechanical structures (MEMS) are fabricated from chemical vapor deposition (CVD) diamond films. Applying microlithographic semiconductor device fabrication process techniques, monolithic diamond piezoresistors are incorporated on a diamond substrate. This paper reviews the design and behavior of diamond MEMS (DMEMS) pressure and accelerometer sensors fabricated on the same scale as silicon devices. The sensors are designed for extreme environments where diamond´s elastic modulus, gauge factor, inertness, and high temperature semiconduction play a vital role in the sensors performance. This work garners more information as to diamond´s piezoresistive (PZR) behavior and functionality as a MEMS device
  • Keywords
    accelerometers; chemical vapour deposition; diamond; elastic moduli; elemental semiconductors; lithography; micromachining; microsensors; piezoresistive devices; pressure sensors; resistors; C; CVD diamond films; DMEMS; MEMS; MEMS device functionality; acceleration sensing; chemical vapor deposition diamond films; diamond MEMS accelerometer sensors; diamond MEMS pressure sensors; diamond inertness; diamond microelectromechanical sensors; diamond piezoresistive behavior; diamond substrate; elastic modulus; extreme environments; gauge factor; high temperature semiconduction; micro-electro-mechanical structures; microlithographic semiconductor device fabrication process techniques; monolithic diamond piezoresistors; pressure sensing; sensor performance; Accelerometers; Chemical sensors; Chemical vapor deposition; Fabrication; Micromechanical devices; Piezoresistive devices; Semiconductor devices; Semiconductor films; Substrates; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectromechanical Systems Conference, 2001
  • Conference_Location
    Berkeley, CA
  • Print_ISBN
    0-7803-7224-7
  • Type

    conf

  • DOI
    10.1109/MEMSC.2001.992739
  • Filename
    992739