Design of 0.35-mm-pitch QFP lead and its assembly technology

Author

Totani, Makoto ; Teshima, Yasuhiro ; Ito, Nobutaka ; Nagatake, Mami ; Otaguro, Hiroyuki

Author_Institution

Fujitsu Labs. Ltd., Kawasaki, Japan

fYear

1994

fDate

1-4 May 1994

Firstpage

43

Lastpage

49

Abstract

The solder joint reliability of a 0.35-mm-lead-pitch, 42 mm wide ×42 mm long ×23 mm high, 396 pin, ceramic quad flat package (QFP) was studied in terms of: A. Finite element analysis simulation using NISA II, B. Temperature cycling test between -65°C and +125°C. Using the study results, physical design of the QFP leads, in terms of thickness, stand-off, and Au surface finish were optimized. Also, we developed a thermocompression (T/C) soldering process for the QFP

Keywords

environmental testing; finite element analysis; integrated circuit packaging; integrated circuit reliability; lead bonding; life testing; soldering; -65 to 125 degC; 0.35 mm; Au surface finish; NISA II; QFP lead; assembly technology; ceramic quad flat package; finite element analysis; solder joint reliability; stand-off; temperature cycling test; thermocompression soldering process; Analytical models; Assembly; Ceramics; Electronics packaging; Finite element methods; Gold; Lead; Soldering; Temperature; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1994. Proceedings., 44th

Conference_Location

Washington, DC

Print_ISBN

0-7803-0914-6

Type

conf

DOI

10.1109/ECTC.1994.367653

Filename

367653