Title :
A 1024-pin plastic ball grid array for flip chip die
Author :
Switky, Andy ; Sajja, Vijay ; Darnauer, J. ; Dai, Wayne Wei Ming
Author_Institution :
Aptix Corp., San Jose, CA, USA
Abstract :
Described in this paper is a 1024-pin ball grid array package (BGA) that contains an area array die flip-chip mounted to a silicon transposer. The transposer, which fans the area array to two rows of pads on its periphery, is wire bonded to a printed circuit board substrate. Mechanical and electrical design considerations of the BGA are discussed, as well as the results of SPICE models
Keywords :
SPICE; fine-pitch technology; flip-chip devices; integrated circuit packaging; lead bonding; plastic packaging; printed circuit design; reflow soldering; SPICE models; area array die; ball grid array package; electrical design; flip chip die; mechanical design; plastic ball grid array; printed circuit board substrate; silicon transposer; wire bonding; Bonding; Ceramics; Costs; Electronics packaging; Etching; Flip chip; Laminates; Plastics; Plugs; Routing;
Conference_Titel :
Electronic Components and Technology Conference, 1994. Proceedings., 44th
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-0914-6
DOI :
10.1109/ECTC.1994.367655
