DocumentCode :
2379344
Title :
Characterization of granularity and redundancy for SRAMs for optimal yield-per-area
Author :
Cha, Jae Chul ; Gupta, Sandeep K.
Author_Institution :
Dept. of Electr. Eng., Univ. of Southern California, Los Angeles, CA
fYear :
2008
fDate :
12-15 Oct. 2008
Firstpage :
219
Lastpage :
226
Abstract :
Memories are significant proportions of most digital systems and memory-intensive chips continue to lead the migration to new nano-fabrication processes. As these processes have increasingly higher defect rates, especially when they are first adopted, such early migration necessitates the use of increasing levels of redundancy to obtain high yield (per area). We show that as we move into nanometer processes with high defect rates, the level of redundancy needed to optimize yield-per-area is sufficiently high so as to significantly influence design tradeoffs. We then report a first step towards considering the overheads of redundancy during design optimization by characterizing the tradeoffs between the granularity of a design and the level of redundancy that optimizes the yield-per-area of static RAMs (SRAMs). Starting with physical layouts of cells and the desired memory size, we derive probabilities of failure at a range of abstractions - transistor level, cell level, and system level. We then estimate optimal memory granularity, i.e., the size of memory blocks, as well as the optimal number of spare rows and columns that maximize yield-per-area. In particular, we demonstrate the non-monotonic nature of these tradeoffs and present efficient designs for large SRAMs. Our ongoing research is characterizing several other specific tradeoffs, for SRAMs as well as logic blocks.
Keywords :
SRAM chips; nanofabrication; SRAM redundancy; granularity characterization; logic blocks; memory-intensive chips; nano-fabrication processes; nanometer processes; optimal yield-per-area; static RAM; Circuits; Design optimization; Digital systems; Fabrication; Logic; Memory architecture; Random access memory; Redundancy; Virtual manufacturing; Yield estimation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer Design, 2008. ICCD 2008. IEEE International Conference on
Conference_Location :
Lake Tahoe, CA
ISSN :
1063-6404
Print_ISBN :
978-1-4244-2657-7
Electronic_ISBN :
1063-6404
Type :
conf
DOI :
10.1109/ICCD.2008.4751865
Filename :
4751865
Link To Document :
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