DocumentCode
2379849
Title
Enhancement-Mode Buried Strained Silicon Channel Double Quantum Dot with Integrated Electrometer
Author
Bishop, Nathaniel ; Lu, TzuMing ; Pluym, Tammy ; Means, Joel ; Kotula, Paul ; Cederberg, Jefferey ; Tracy, Lisa ; Dominguez, Jason ; Lilly, Michael ; Carroll, Malcolm
Author_Institution
Sandia Nat. Labs., Albuquerque, NM, USA
fYear
2012
fDate
4-6 June 2012
Firstpage
1
Lastpage
2
Abstract
We propose and demonstrate a relaxed-SiGe/sSi enhancement-mode gate stack for quantum dots. The wafers are grown to our specification using CVD process by Lawrence SQI. The devices were fabricated within a 150 mm Si foundry setting that uses implanted ohmics and chemical-vapor-deposited dielectrics. Polysilicon depletion gates are used to form few electron dots in the sSi quantum well. High density plasma silicon dioxide was used as a secondary dielectric, followed by a tungsten/titanium nitride enhancement gate to draw electrons into the system. A modified implant, polycrystalline silicon formation and annealing conditions were utilized to minimize the thermal budget that potentially leads to Ge/Si interdiffusion.
Keywords
Coulomb blockade; Ge-Si alloys; annealing; chemical vapour deposition; elemental semiconductors; semiconductor growth; semiconductor quantum dots; semiconductor quantum wells; CVD process; Lawrence SQI; SiGe-Si; annealing conditions; chemical-vapor-deposited dielectrics; enhancement-mode buried strained silicon channel double quantum dot; enhancement-mode gate stack; high density plasma silicon dioxide; integrated electrometer; periodic Coulomb blockade conductance oscillations; polycrystalline silicon formation; polysilicon depletion gates; quantum well; secondary dielectric; size 150 nm; thermal budget; tungsten-titanium nitride enhancement gate; Dielectrics; Laboratories; Logic gates; Quantum computing; Quantum dots; Silicon; Silicon germanium;
fLanguage
English
Publisher
ieee
Conference_Titel
Silicon-Germanium Technology and Device Meeting (ISTDM), 2012 International
Conference_Location
Berkeley, CA
Print_ISBN
978-1-4577-1864-9
Electronic_ISBN
978-1-4577-1863-2
Type
conf
DOI
10.1109/ISTDM.2012.6222467
Filename
6222467
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