• DocumentCode
    2379875
  • Title

    Strained High Percentage (60%) Boron Doped Silicon-Germanium Alloys - Strain, Dopant Substitionality, Carrier Concentration, Resistivity, and Microstructure Development

  • Author

    Reznicek, Alexander ; Adam, Thomas N. ; Hovel, Harold ; De Souza, Joel ; Zhu, Zhengmao ; Li, Jinghong ; Bedell, Stephen W. ; Paruchuri, Vamsi ; Sadana, Devendra K.

  • Author_Institution
    IBM Thomas J Watson Res. Center, Yorktown Heights, NY, USA
  • fYear
    2012
  • fDate
    4-6 June 2012
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    In this work we study the incorporation of boron into fully strained high percentage (60%) boron doped Silicon-Germanium (SiGe). We will discuss the epitaxial growth, dopant incorporation, and strain compensation due to the dopant atoms, defect generation in highly strained doped SiGe layers as well as dopant activation, free carrier concentration and mobilities. We will look at band structure effects due to high doping in strained SiGe layers.
  • Keywords
    Ge-Si alloys; band structure; boron; carrier mobility; crystal microstructure; epitaxial growth; semiconductor growth; semiconductor materials; SiGe:B; band structure effects; boron doped silicon-germanium alloys; carrier concentration; defect generation; dopant activation; dopant atoms; dopant substitionality; epitaxial growth; microstructure development; strain compensation; Boron; Doping; Epitaxial growth; Microstructure; Silicon germanium; Strain; USA Councils;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Silicon-Germanium Technology and Device Meeting (ISTDM), 2012 International
  • Conference_Location
    Berkeley, CA
  • Print_ISBN
    978-1-4577-1864-9
  • Electronic_ISBN
    978-1-4577-1863-2
  • Type

    conf

  • DOI
    10.1109/ISTDM.2012.6222468
  • Filename
    6222468