DocumentCode
2379875
Title
Strained High Percentage (60%) Boron Doped Silicon-Germanium Alloys - Strain, Dopant Substitionality, Carrier Concentration, Resistivity, and Microstructure Development
Author
Reznicek, Alexander ; Adam, Thomas N. ; Hovel, Harold ; De Souza, Joel ; Zhu, Zhengmao ; Li, Jinghong ; Bedell, Stephen W. ; Paruchuri, Vamsi ; Sadana, Devendra K.
Author_Institution
IBM Thomas J Watson Res. Center, Yorktown Heights, NY, USA
fYear
2012
fDate
4-6 June 2012
Firstpage
1
Lastpage
2
Abstract
In this work we study the incorporation of boron into fully strained high percentage (60%) boron doped Silicon-Germanium (SiGe). We will discuss the epitaxial growth, dopant incorporation, and strain compensation due to the dopant atoms, defect generation in highly strained doped SiGe layers as well as dopant activation, free carrier concentration and mobilities. We will look at band structure effects due to high doping in strained SiGe layers.
Keywords
Ge-Si alloys; band structure; boron; carrier mobility; crystal microstructure; epitaxial growth; semiconductor growth; semiconductor materials; SiGe:B; band structure effects; boron doped silicon-germanium alloys; carrier concentration; defect generation; dopant activation; dopant atoms; dopant substitionality; epitaxial growth; microstructure development; strain compensation; Boron; Doping; Epitaxial growth; Microstructure; Silicon germanium; Strain; USA Councils;
fLanguage
English
Publisher
ieee
Conference_Titel
Silicon-Germanium Technology and Device Meeting (ISTDM), 2012 International
Conference_Location
Berkeley, CA
Print_ISBN
978-1-4577-1864-9
Electronic_ISBN
978-1-4577-1863-2
Type
conf
DOI
10.1109/ISTDM.2012.6222468
Filename
6222468
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