• DocumentCode
    2379967
  • Title

    Parametric structure-preserving model order reduction

  • Author

    Villena, Jorge Fernandez ; Schilders, Wil H A ; Silveira, L. Miguel

  • Author_Institution
    INESC-ID/IST - Tech. U. Lisbon Rua Alves Redol 9 1000-029, Portugal
  • fYear
    2007
  • fDate
    15-17 Oct. 2007
  • Firstpage
    31
  • Lastpage
    36
  • Abstract
    Analysis and verification environments for next- generation nano-scale RFIC designs must be able to cope with increasing design complexity and to account for new effects, such as process variations and Electromagnetic (EM) couplings. Designed-in passives, substrate, interconnect and devices can no longer be treated in isolation as the interactions between them are becoming more relevant in the behavior of the complete system. At the same time variations in process parameters lead to small changes in the device characteristics that may directly affect system performance. These two effects, however, can not be treated separately as the process variations that modify the physical parameters of the devices also affect those same EM couplings. Accurately capturing the effects of process variations as well as the relevant EM coupling effects requires detailed models that become very expensive to simulate. Reduction techniques able to handle parametric descriptions of linear systems are necessary in order to obtain better simulation performance. In this work Model Order Reduction techniques able to handle parametric system descriptions are presented. Such techniques are based on Structure-Preserving formulations that are able to exploit the hierarchical system representation of designed- in blocks, substrate and interconnect, in order to obtain more efficient simulation models.
  • Keywords
    Coupling circuits; Electromagnetic coupling; Fluctuations; Frequency; Integrated circuit interconnections; Mathematics; Parametric statistics; Radiofrequency integrated circuits; Substrates; Uncertainty;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Very Large Scale Integration, 2007. VLSI - SoC 2007. IFIP International Conference on
  • Conference_Location
    Atlanta, GA, USA
  • Print_ISBN
    978-1-4244-1710-0
  • Electronic_ISBN
    978-1-4244-1710-0
  • Type

    conf

  • DOI
    10.1109/VLSISOC.2007.4402468
  • Filename
    4402468