• DocumentCode
    2380185
  • Title

    CVD Epitaxial Growth of GeSn Opens a New Route for Advanced Sn-Based Logic and Photonics Devices

  • Author

    Vincent, Benjamin ; Gencarelli, Federica ; Kumar, Arul ; Vantomme, Andre ; Merckling, Clement ; Lin, Dennis ; Afanasiev, Valeri ; Eneman, Geert ; Clarysse, Trudo ; Firrincieli, Andrea ; Gassenq, Alban ; Vandervorst, Wilfried ; Dekoster, Johan ; Loo, Roger

  • Author_Institution
    imec, Heverlee, Belgium
  • fYear
    2012
  • fDate
    4-6 June 2012
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Interest in Sn-based semiconductors largely increased during the last decade (Fig. 1). If doubts remained in the early 2000´s on the hypothetical use of (Si)GeSn epitaxial layers in advanced technologies (mainly due to the low Sn solubility in Si and Ge and the associated reduced thermal stability of those alloys), recent publications from various groups provide today a much better feeling on the potential of those materials. First of all, the growth of GeSn layers with high Sn content was demonstrated by different techniques overruling their apparent thermodynamics limitations. Next, and especially very recently, Sn-based devices are showing up: GeSn MOSCAP, GeSn pMOSFET or GeSn photodetectors for instance. This paper reviews the deposition techniques and different integration schemes to implement GeSn in various technologies and highlights the potential benefits in logic and photonics devices.
  • Keywords
    chemical vapour deposition; epitaxial growth; epitaxial layers; logic devices; CVD epitaxial growth; deposition technique; epitaxial layers; logic device; photodetectors; photonics device; semiconductors; thermodynamics limitation; Atomic layer deposition; Atomic measurements; Electrical resistance measurement; Epitaxial growth; Photonics; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Silicon-Germanium Technology and Device Meeting (ISTDM), 2012 International
  • Conference_Location
    Berkeley, CA
  • Print_ISBN
    978-1-4577-1864-9
  • Electronic_ISBN
    978-1-4577-1863-2
  • Type

    conf

  • DOI
    10.1109/ISTDM.2012.6222486
  • Filename
    6222486