• DocumentCode
    2380215
  • Title

    Issue system protection mechanisms

  • Author

    Chaparro, Pedro ; Abella, Jaume ; Carretero, Javier ; Vera, Xavier

  • Author_Institution
    Intel Barcelona Res. Center, Intel Labs. - Univ. Politec. de Catalunya, Barcelona
  • fYear
    2008
  • fDate
    12-15 Oct. 2008
  • Firstpage
    599
  • Lastpage
    604
  • Abstract
    Multi-core microprocessors require reducing the FIT (failures-in-time) rate per core drastically to enable a larger number of cores within a FIT budget. Since large arrays like caches and register flies are typically protected with either ECC or parity, the issue system becomes as one of the largest contributors to the core´s FIT rate. Soft-errors are an important concern in contemporary microprocessors. Particle hits on the components of a processor are expected to create an increasing number of transient errors in each new microprocessor generation. In addition, the number of hard-errors in the field is expected to grow as burn-in becomes less effective. Moreover, the continuous device shrinking increases the likelihood of in-the-field failures due to rather small defects exacerbated by degradation. This paper proposes on-line mechanisms to detect and recover to a consistent state, classify and confine in-the-field errors in the issue system of both in-order and out-of-order cores. Such mechanisms provide high coverage at a small cost.
  • Keywords
    multiprocessing systems; system recovery; failures-in-time rate per core; issue system protection; multicore microprocessor; soft errors; transient errors; Built-in self-test; Costs; Degradation; Error correction codes; Hardware; Microprocessors; Out of order; Proposals; Protection; Vehicle crash testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Design, 2008. ICCD 2008. IEEE International Conference on
  • Conference_Location
    Lake Tahoe, CA
  • ISSN
    1063-6404
  • Print_ISBN
    978-1-4244-2657-7
  • Electronic_ISBN
    1063-6404
  • Type

    conf

  • DOI
    10.1109/ICCD.2008.4751922
  • Filename
    4751922