• DocumentCode
    2380232
  • Title

    Power switch characterization for fine-grained dynamic voltage scaling

  • Author

    Di, Liang ; Putic, Mateja ; Lach, John ; Calhoun, Benton H.

  • Author_Institution
    Intel Corp., Santa Clara, CA
  • fYear
    2008
  • fDate
    12-15 Oct. 2008
  • Firstpage
    605
  • Lastpage
    611
  • Abstract
    Dynamic voltage scaling (DVS) provides power savings for systems with varying performance requirements. One low overhead implementation of DVS uses PMOS power switches to connect DVS blocks to one of the available VDD supplies. While power switches have been analyzed extensively for leakage power gating, proper design of power switches for DVS is less well understood. This paper characterizes power switches for DVS in terms of VDD-switching delay and VDD-switching energy. We show the impact of these switching overheads on a novel fine-grained DVS architecture and present an RC model that allows fast estimation of the overhead. Measurements of a DVS multiplier and adder on a 90 nm CMOS test chip validate the model. Our model and measurements confirm that power switched DVS can provide sufficiently low overhead to give energy savings with only one clock cycle spent at a lower voltage, making this approach a flexible and enticing option for embedded portable systems.
  • Keywords
    CMOS integrated circuits; adders; field effect transistor switches; multiplying circuits; CMOS test chip; PMOS power switches; RC model; dynamic voltage scaling; leakage power gating; size 90 nm; switching delay; switching overhead; Clocks; Delay; Dynamic voltage scaling; Energy measurement; Power measurement; Power system modeling; Semiconductor device measurement; Semiconductor device modeling; Testing; Voltage control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Design, 2008. ICCD 2008. IEEE International Conference on
  • Conference_Location
    Lake Tahoe, CA
  • ISSN
    1063-6404
  • Print_ISBN
    978-1-4244-2657-7
  • Electronic_ISBN
    1063-6404
  • Type

    conf

  • DOI
    10.1109/ICCD.2008.4751923
  • Filename
    4751923