• DocumentCode
    2380489
  • Title

    Relaxed Germanium on Porous Silicon Substrates

  • Author

    Wietler, Tobias F. ; Rugeramigabo, Eddy P. ; Bugiel, Eberhard ; Rojas, Enrique Garralaga

  • Author_Institution
    Inst. of Electron. Mater. & Devices, Leibniz Univ. Hannover, Hannover, Germany
  • fYear
    2012
  • fDate
    4-6 June 2012
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    In this paper, the authors study the surfactant-mediated epitaxy (SME) of relaxed Ge films on (001)-orientated porous silicon wafers, which could be a first step towards a cost-efficient lift-off technique for lightweight high-efficiency multijunction Ge/III-V solar cells. Transmission electron microscopy (TEM) and high-resolution X-ray diffraction (XRD) investigations show full relaxation and high structural perfection of the epitaxial Ge. An abrupt interface showing no evidence for intermixing is formed between Ge and Si. Similar to SME of Ge on standard Si(001) wafers the lattice mismatch is compensated by a periodic array of full edge dislocations parallel to the interface. XRD measurements indicate that part of the silicon is under a small tensile strain. The authors attribute this to partial strain accommodation in the top silicon layer of the porous substrate which acts as a compliant substrate.
  • Keywords
    Ge-Si alloys; X-ray diffraction; dislocations; epitaxial growth; solar cells; stress relaxation; surfactants; transmission electron microscopes; Ge-Si; TEM; XRD; cost efficient lift-off technique; full edge dislocations; high resolution X-ray diffraction; lightweight high efficiency multijunction solar cell; porous wafer; surfactant-mediated epitaxy; transmission electron microscopy; Epitaxial growth; Germanium; Lattices; Photovoltaic cells; Silicon; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Silicon-Germanium Technology and Device Meeting (ISTDM), 2012 International
  • Conference_Location
    Berkeley, CA
  • Print_ISBN
    978-1-4577-1864-9
  • Electronic_ISBN
    978-1-4577-1863-2
  • Type

    conf

  • DOI
    10.1109/ISTDM.2012.6222502
  • Filename
    6222502