DocumentCode :
2380536
Title :
Stability of Tensile-Strained Ge Studied by Transmission Electron Microscopy
Author :
Qi, Meng ; Brien, William A O ; Stephenson, Chad A. ; Cao, Ning ; Thibeault, Brian J. ; Wistey, Mark A.
Author_Institution :
Dept. of Electr. Eng., Univ. of Notre Dame, Notre Dame, IN, USA
fYear :
2012
fDate :
4-6 June 2012
Firstpage :
1
Lastpage :
2
Abstract :
The sensitivity of strained Ge to damage after irradiation with 300kV electron-beam was studied. A time-dependent damage analysis under TEM irradiation on two 0.5 μm-width waveguides, one with 1 GPa stress and a 20 nm protection layer, the other with 2 GPa stress but no protection layer, was performed. The interface for highly-strained waveguides was severely damaged by e-beam within mere seconds, and the damage propagated into the deeper region with time. For the weakly strained sample, the weak damage was confined within 2 nm of the interface and did not propagate. Highly strained Ge interfaces were susceptible to damage, and the dislocations propagated deep into the waveguide.
Keywords :
deformation; dislocations; electron beam effects; elemental semiconductors; germanium; silicon compounds; transmission electron microscopy; Ge-SiNx; TEM; dislocations; electron-beam irradiation; highly-strained waveguides; sensitivity; size 20 nm; stress; tensile-strained interface; time-dependent damage analysis; transmission electron microscopy; Films; Laser theory; Optical waveguides; Photonic band gap; Stress; Tensile strain;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Silicon-Germanium Technology and Device Meeting (ISTDM), 2012 International
Conference_Location :
Berkeley, CA
Print_ISBN :
978-1-4577-1864-9
Electronic_ISBN :
978-1-4577-1863-2
Type :
conf
DOI :
10.1109/ISTDM.2012.6222505
Filename :
6222505
Link To Document :
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