DocumentCode
2380613
Title
The Effect of Ge Condensation on Channel Strain during the Post Annealing Process of Recessed Source/Drain Si1-xGex
Author
Ko, Dae-Hong ; Kim, Sun-Wook ; Koo, Sangmo ; Jung, Mijin ; Lee, Hoo-Jeong
Author_Institution
Dept. of Mater. Sci. & Eng., Yonsei Univ., Seoul, South Korea
fYear
2012
fDate
4-6 June 2012
Firstpage
1
Lastpage
2
Abstract
In summary, we investigated the possibility of effectively increasing the channel strain by oxidation and silicidation of recessed Si1-xGex S/D structures and producing a Ge condensation layer. By combining EDS and NBD techniques, we were able to analyze the thickness and composition of the Ge condensation layer formed upon post annealing process, and the evolution of the channel strain. The NBD results clearly showed that this method can be critically used to effectively increase the channel strain.
Keywords
Ge-Si alloys; annealing; oxidation; EDS technique; NBD technique; Si1-xGex; channel strain; composition analysis; germanium condensation; oxidation; post annealing process; recessed source; silicidation; thickness analysis; Annealing; Electron beams; Epitaxial growth; Oxidation; Silicidation; Silicon germanium; Strain;
fLanguage
English
Publisher
ieee
Conference_Titel
Silicon-Germanium Technology and Device Meeting (ISTDM), 2012 International
Conference_Location
Berkeley, CA
Print_ISBN
978-1-4577-1864-9
Electronic_ISBN
978-1-4577-1863-2
Type
conf
DOI
10.1109/ISTDM.2012.6222510
Filename
6222510
Link To Document