Optimum IR drop models for estimation of metal resource requirements for power distribution network

In this paper, we present closed form IR drop models for power distribution network in N-metal layer system for wire-bond and flip-chip packages, given design constraints such as chip power dissipation, total static IR drop budget and power supply voltage along with manufacturability and EM constraints as per the technology. The models proposed empowers designers to perform trade-off analysis for effective metal resource utilization in the power distribution network and meeting design specific signal routing needs in desired metal layers. The power distribution network designed using the proposed models have been verified for EM and IR drop on 90nm, 65nm and 45nm designs with industry standard EMIR analysis tool and are within 1–5% of error limit for both wire- bond and flip-chip designs.