Title :
High-Q FBAR filters in a wafer-level chip-scale package
Author :
Ruby, R.C. ; Barfknecht, A. ; Han, C. ; Desai, Y. ; Geefay, F. ; Gan, G. ; Gat, M. ; Verhoeven, T.
Author_Institution :
Agilent, Newark, CA, USA
Abstract :
Wafer-level chip-scale packaged RF filters use thin-film bulk acoustic resonator technology. The 1/spl times/1mm/sup 2/ high-Q filter is hermetically sealed as two thin layers of silicon. The full-band 1900 MHz Tx filter mounted in a PCS power module has a 12 MHz roll-off, and replaces external split-band SAW filters and their accompanying switches.
Keywords :
acoustic resonator filters; chip scale packaging; elemental semiconductors; silicon; thin film devices; 12 MHz; 12 MHz roll-off; 1900 MHz; CDMA power modules; Si layers; chip-scale packaged RF filters; external split-band SAW filters; high-Q FBAR filters; high-Q filter; microcap; thin-film bulk acoustic resonator; wireless communication; wireless components; Chip scale packaging; Film bulk acoustic resonators; Hermetic seals; Multichip modules; Personal communication networks; Radio frequency; Resonator filters; Silicon; Transistors; Wafer scale integration;
Conference_Titel :
Solid-State Circuits Conference, 2002. Digest of Technical Papers. ISSCC. 2002 IEEE International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-7335-9
DOI :
10.1109/ISSCC.2002.992997
