DocumentCode
2380925
Title
Peltier current lead experiments with a thermoelectric semiconductor near 77 K [and HTSC]
Author
Yamaguchi, S. ; Nakamura, H. ; Ikeda, K. ; Sakurai, T. ; Yoshida, I. ; Tanuma, S. ; Tobise, S. ; Koumoto, K.
Author_Institution
Nat. Inst. for Fusion Sci., Toki, Japan
fYear
1997
fDate
26-29 Aug 1997
Firstpage
657
Lastpage
660
Abstract
Peltier current lead was proposed to reduce heat leak from the current lead. The temperature of the hot side of semiconductors was kept to be a room temperature and the liquid nitrogen was used to cool the system in the experiment. The experiment confirmed the principle of the Peltier current lead, and the reduction of the heat leak is calculated to be 30% for the liquid helium system and 40% for the liquid nitrogen system. We also proposed a new current lead system which is composed of semiconductors and high temperature superconducting material (HTS). This idea bases on the functionally gradient material (FGM), and the HTS is connected to the semiconductor directly. The temperature of the hot side of semiconductor is kept to be the liquid nitrogen temperature, the temperature of HTS can be expected to be lower than 77 K. Therefore, we can expect high current capacity of the HTS and/or high stability of the HTS. We use BiSb as a N-type semiconductor and BiTe as a P-type semiconductor in the experiment, and the temperature of the cold side of the semiconductor is 73 K in this experiment
Keywords
Peltier effect; heat pumps; high-temperature superconductors; superconducting cables; thermoelectric devices; 73 K; 77 K; BiSb; BiTe; HTSC; Peltier current lead; functionally gradient material; heat leak reduction; high current capacity; high stability; hot side temperature; thermoelectric semiconductor; Coolants; Helium; High temperature superconductors; Lead compounds; Nitrogen; Semiconductor materials; Superconducting magnets; Superconducting materials; Thermal conductivity; Thermoelectricity;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 1997. Proceedings ICT '97. XVI International Conference on
Conference_Location
Dresden
ISSN
1094-2734
Print_ISBN
0-7803-4057-4
Type
conf
DOI
10.1109/ICT.1997.667615
Filename
667615
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