• DocumentCode
    2382200
  • Title

    Optimization of the ArctiCooler for lowest thermal resistance in a minimum volume

  • Author

    Wagner, Guy R.

  • Author_Institution
    PolarLogic Agilent Technol. Inc., Fort Collins, CO
  • Volume
    2
  • fYear
    2000
  • fDate
    2000
  • Lastpage
    184
  • Abstract
    The trends in processor power are increasing at an alarming rate with each generation of processor as clock speeds are being pushed beyond 1 GHz. Processor power is predicted to reach the 200 watt level in the next 3 to 5 years. This may have a severe impact on architecture of future systems, especially desktop machines that must operate quietly in the office or home environment. The ArctiCooler was developed by Hewlett-Packard just for this purpose; to cool high-power processors at minimal noise levels. This paper describes the steps taken to optimize the ArctiCooler (alias TurboCooler) to achieve the lowest thermal resistance possible in a minimum volume
  • Keywords
    cooling; heat sinks; microprocessor chips; thermal resistance; ArctiCooler; Hewlett-Packard; TurboCooler; design optimization; desktop machine; fansink; heat sink; high power processor; impingement cooling; thermal resistance; volume minimization; Design optimization; Electronic packaging thermal management; Entropy; Heat sinks; Heat transfer; Resistance heating; Surface resistance; Thermal conductivity; Thermal expansion; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on
  • Conference_Location
    Las Vegas, NV
  • ISSN
    1089-9870
  • Print_ISBN
    0-7803-5912-7
  • Type

    conf

  • DOI
    10.1109/ITHERM.2000.866163
  • Filename
    866163