DocumentCode :
2382434
Title :
Component temperature prediction in printed circuit boards with boundary integral method
Author :
Bambace, Luis Antonio Waack ; Garcia, Ezio Castejon ; Melo, Clausio, Jr.
Author_Institution :
INPE, Brazilian Nat. Inst. for Space Res., Brazil
Volume :
2
fYear :
2000
fDate :
2000
Firstpage :
94
Abstract :
This paper covers temperature predictions in electronic assemblies with the boundary integral equation method (BIEM). It is applicable to any linear differential equation regardless of the boundary conditions, once it is intrinsically based on the effects superposition principle. The BIEM is applied to problems with and without isotropy. One advantage of the method is the simplicity and easiness of application to a large number of practical problems. To plates with isotropy, insulated borders, and bolt heat drains, the use of images allows a solution without using any grid. Experimental data and finite differences solutions are used to confirm the BIEM results
Keywords :
boundary integral equations; heat sinks; printed circuit design; temperature distribution; BIEM; bolt heat drains; boundary integral equation method; component temperature prediction; effects superposition principle; finite differences solutions; insulated borders; isotropy; linear differential equation; printed circuit boards; Boundary conditions; Fasteners; Finite difference methods; Heat transfer; Integral equations; Printed circuits; Temperature; Thermal conductivity; Thermal resistance; Transmission line matrix methods;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on
Conference_Location :
Las Vegas, NV
ISSN :
1089-9870
Print_ISBN :
0-7803-5912-7
Type :
conf
DOI :
10.1109/ITHERM.2000.866176
Filename :
866176
Link To Document :
بازگشت