DocumentCode :
2382578
Title :
Experimental investigation of flow transition in microchannels using micron-resolution particle image velocimetry
Author :
Zeighami, R. ; Laser, D. ; Zhou, P. ; Asheghi, M. ; Devasenathipathy, S. ; Kenny, T. ; Santiago, J. ; Goodson, K.
Author_Institution :
Dept. of Mech. Eng., Stanford Univ., CA, USA
Volume :
2
fYear :
2000
fDate :
2000
Firstpage :
148
Abstract :
Microchannel heat sinks are promising for cooling applications in advanced electronic systems. More research is needed to understand microchannel flow regimes. Recent pressure drop data in microchannels with hydraulic diameters between 50 and 300 μm suggest that the transition to turbulence may occur at lower than expected values of the Reynolds number. This work studies turbulent transition in microchannels using micron-resolution particle imaging velocimetry (μPIV) with epifluorescent microscopy of 950 nm particles. Silicon channels with dimensions 150 μm×100 μm×1 cm are fabricated using deep reactive ion etching and sealed using a glass plate. Velocity field data for 200<Re<1600 suggest transition for 1200>Re>1600, which is lower than values near 2200 measured previously for larger channels with similar shapes. This discrepancy may be caused by wall roughness, viscous heat generation, or electrokinetic effects. The experimental approach developed here provides the groundwork for a detailed study of turbulence transition in microchannels
Keywords :
cooling; electrokinetic effects; flow visualisation; heat sinks; packaging; turbulence; velocimeters; 50 to 300 micron; Reynolds number; advanced electronic systems; cooling; deep reactive ion etching; electrokinetic effects; epifluorescent microscopy; flow transition; heat sinks; microchannels; micron-resolution particle image velocimetry; pressure drop data; turbulence; velocity field data; viscous heat generation; wall roughness; Electronics cooling; Etching; Glass; Heat sinks; Hydraulic diameter; Microchannel; Microscopy; Shape measurement; Silicon; Velocity measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on
Conference_Location :
Las Vegas, NV
ISSN :
1089-9870
Print_ISBN :
0-7803-5912-7
Type :
conf
DOI :
10.1109/ITHERM.2000.866184
Filename :
866184
Link To Document :
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