Effects of plasticity on reliability in multilayered electronic packages

Author

Shaw, M.C. ; He, Jun ; Mather, J.C. ; Addison, R.C.

Author_Institution

Rockwell Sci. Center, Thousand Oaks, CA, USA

Volume

2

fYear

2000

fDate

2000

Firstpage

279

Abstract

The effect of the constitutive response of the solder material on the reliability of large area solder joints within multilayered electronic packages is investigated subject to repeated thermal cycling. Solders that exhibit elastic and time-dependent plastic flow (viscoplasticity) were investigated. In accordance with traditional low-cycle fatigue models, the solder that exhibited extensive viscoplasticity exhibited fatigue cracking that can be modelled following a Coffin-Manson approach for crack initiation. Subsequent crack growth was pronounced. In contrast, the solder that exhibited an elastic response exhibited a substantially lower fatigue crack nucleation and growth rate. These results are then related to the overall design philosophy of the package

Keywords

elastoplasticity; fatigue cracks; semiconductor device packaging; semiconductor device reliability; soldering; viscoplasticity; Coffin-Manson approach; crack growth; crack initiation; design philosophy; elastic response; fatigue crack nucleation; large area solder joints; low-cycle fatigue models; multilayered electronic packages; reliability; repeated thermal cycling; solder material; time-dependent plastic flow; viscoplasticity; Electronic packaging thermal management; Electronics packaging; Fatigue; Insulated gate bipolar transistors; Joining materials; Materials reliability; Multichip modules; Plastic packaging; Soldering; Stress;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on

Conference_Location

Las Vegas, NV

ISSN

1089-9870

Print_ISBN

0-7803-5912-7

Type

conf

DOI

10.1109/ITHERM.2000.866203

Filename

866203