Modeling and minimization of intercascade thermal resistance in multi-stage thermoelectric cooler

Author

Semeniouk, Vladimir A. ; Berzverkbov, D.B.

Author_Institution

Thermion Co., Odessa State Acad. of Refrigeration, Russia

fYear

1997

fDate

26-29 Aug 1997

Firstpage

701

Lastpage

704

Abstract

The problem of achieving highest temperature difference ΔT in cascade thermoelectric cooler (TEC) is solved with consideration of intercascade thermal resistance. The model of three-dimensional heat spread in substrates is considered. Existence of substrate optimum thickness corresponding to highest ΔT is established. It is shown that correct choice of substrate configuration permits to receive considerable increase in TEC efficiency. In particular, it concerns short-legged TECs having extremely high heat flux densities

Keywords

Laplace equations; cooling; heat pumps; heat sinks; modules; temperature distribution; thermal resistance; thermoelectric conversion; thermoelectric devices; Laplace equation; cascade thermoelectric cooler; efficiency; high heat flux densities; highest temperature difference; intercascade thermal resistance; minimization; modeling; multistage thermoelectric cooler; substrate optimum thickness; temperature distribution; three-dimensional heat spread; Electric resistance; Heat sinks; Leg; Resistance heating; Surface resistance; Tellurium; Temperature distribution; Thermal conductivity; Thermal resistance; Thermoelectricity;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermoelectrics, 1997. Proceedings ICT '97. XVI International Conference on

Conference_Location

Dresden

ISSN

1094-2734

Print_ISBN

0-7803-4057-4

Type

conf

DOI

10.1109/ICT.1997.667627

Filename

667627