Electronic package thermal response prediction to power surge

Author

Li Xu, Yong ; Stout, Roger ; Billings, David

Author_Institution

Strategic Package Characterization Lab., ON Semicond., Phoenix, AZ, USA

Volume

2

fYear

2000

fDate

2000

Firstpage

366

Abstract

A predictive technique combining the thermal/electrical RC analogy and linear superposition is presented, which estimates the package´s thermal response to power surge based on its thermal transient step response. The solution so developed was compared with finite element analysis (FEA) results, and the match is reasonably good. The technique presented in this paper can be extended to different packages, modules, etc. and for various thermal stimuli so long as the principles of the RC analogy and superposition scheme hold

Keywords

finite element analysis; modules; semiconductor device packaging; thermal analysis; transient response; electronic package; finite element analysis; linear superposition; modules; power surge; predictive technique; thermal response prediction; thermal stimuli; thermal transient step response; thermal/electrical RC analogy; Cooling; Electronic packaging thermal management; Finite element methods; Laplace equations; Surges; Temperature dependence; Temperature sensors; Testing; Thermal resistance; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on

Conference_Location

Las Vegas, NV

ISSN

1089-9870

Print_ISBN

0-7803-5912-7

Type

conf

DOI

10.1109/ITHERM.2000.866216

Filename

866216