• DocumentCode
    2383608
  • Title

    Failure Mechanisms and comparative study of ruggedness in IGBTs Devices (IR, IXYS)

  • Author

    Benbahouche, Ly ; Merabet, A. ; Zegadi, A.

  • Author_Institution
    Dept. of Opt., Univ. Ferhat Abbas, Setif, Algeria
  • fYear
    2012
  • fDate
    13-16 May 2012
  • Firstpage
    111
  • Lastpage
    114
  • Abstract
    This paper present a detailed study of performance of two the most commercially available IGBT for International Rectifier and IXYS e.g. IRGBC40 (S, F,U) and IXGH40N60A, when subjected to two such stressful conditions short circuit operation and unclamped inductive switching and it takes into account specific phenomena limiting its SOA (Safe Operation Area), avalanche, second breakdown as well as latch up. As both these tests conditions are potentially destructive, it is extremely cost efficient to model the device performance under these conditions. The need of a good physics based simulation to carry out a reliability study is pointed out in this paper. An explanation comparison of ruggedness of IRGBC40 (S,F,U) as well as of IXGH40N60A which leads to a fundamental understanding of physics of two devices.
  • Keywords
    flip-flops; insulated gate bipolar transistors; integrated circuit reliability; rectifiers; IGBT device; IRGBC40 (S, F,U); IXGH40N60A; avalanche; failure mechanism; international rectifier; latch up; physics based simulation; reliability study; safe operation area; second breakdown; short circuit operation; unclamped inductive switching; Electric breakdown; Inductors; Insulated gate bipolar transistors; Integrated circuit modeling; Latches; Logic gates; Switching circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics (MIEL), 2012 28th International Conference on
  • Conference_Location
    Nis
  • ISSN
    pending
  • Print_ISBN
    978-1-4673-0237-1
  • Type

    conf

  • DOI
    10.1109/MIEL.2012.6222809
  • Filename
    6222809