DocumentCode
2383608
Title
Failure Mechanisms and comparative study of ruggedness in IGBTs Devices (IR, IXYS)
Author
Benbahouche, Ly ; Merabet, A. ; Zegadi, A.
Author_Institution
Dept. of Opt., Univ. Ferhat Abbas, Setif, Algeria
fYear
2012
fDate
13-16 May 2012
Firstpage
111
Lastpage
114
Abstract
This paper present a detailed study of performance of two the most commercially available IGBT for International Rectifier and IXYS e.g. IRGBC40 (S, F,U) and IXGH40N60A, when subjected to two such stressful conditions short circuit operation and unclamped inductive switching and it takes into account specific phenomena limiting its SOA (Safe Operation Area), avalanche, second breakdown as well as latch up. As both these tests conditions are potentially destructive, it is extremely cost efficient to model the device performance under these conditions. The need of a good physics based simulation to carry out a reliability study is pointed out in this paper. An explanation comparison of ruggedness of IRGBC40 (S,F,U) as well as of IXGH40N60A which leads to a fundamental understanding of physics of two devices.
Keywords
flip-flops; insulated gate bipolar transistors; integrated circuit reliability; rectifiers; IGBT device; IRGBC40 (S, F,U); IXGH40N60A; avalanche; failure mechanism; international rectifier; latch up; physics based simulation; reliability study; safe operation area; second breakdown; short circuit operation; unclamped inductive switching; Electric breakdown; Inductors; Insulated gate bipolar transistors; Integrated circuit modeling; Latches; Logic gates; Switching circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics (MIEL), 2012 28th International Conference on
Conference_Location
Nis
ISSN
pending
Print_ISBN
978-1-4673-0237-1
Type
conf
DOI
10.1109/MIEL.2012.6222809
Filename
6222809
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