• DocumentCode
    2383669
  • Title

    Exploring indium antimonide (InSb) as novel channel material for nanoscale devices using simulation approach

  • Author

    Vaid, R. ; Prasher, R.

  • Author_Institution
    Dept. of Phys. & Electron., Univ. of Jammu, Jammu, India
  • fYear
    2012
  • fDate
    13-16 May 2012
  • Firstpage
    119
  • Lastpage
    122
  • Abstract
    In this paper, we have discussed a ballistic nanoscale MOSFET using simulation approach by replacing silicon in the channel by III-V compounds. The channel materials considered are silicon (Si), germanium (Ge), Gallium arsenide (GaAs), Indium arsenide (InAs), Zinc oxide (ZnO), Zinc Sulphide (ZnS), Indium Phosphide (InP) and Indium Antimonide (InSb). The device metrics considered at the nanometer scale are subthreshold swing, Drain induced barrier lowering, on and off current, carrier injection velocity and switching speed. FETToy simulator has been used for the simulations. Various channel materials have been compared and various output parameters obtained & calculated. It has been observed that Indium Antimonide (InSb) has higher on current, higher transconductance, idealistic subthreshold swing, higher output conductance, higher carrier injection velocity and lower voltage gain compared to Silicon, thus, making InSb as a possible candidate to be used as channel material in future nanoscale devices.
  • Keywords
    III-V semiconductors; MOSFET; indium compounds; nanoelectronics; FETToy simulator; III-V compounds; InSb; ballistic nanoscale MOSFET; carrier injection velocity; channel material; drain induced barrier lowering; high output conductance; high transconductance; idealistic subthreshold swing; nanoscale devices; simulation approach; switching speed; Gallium arsenide; Germanium; Logic gates; Quantum capacitance; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics (MIEL), 2012 28th International Conference on
  • Conference_Location
    Nis
  • ISSN
    pending
  • Print_ISBN
    978-1-4673-0237-1
  • Type

    conf

  • DOI
    10.1109/MIEL.2012.6222811
  • Filename
    6222811