• DocumentCode
    2385069
  • Title

    Skinny trace compensation methodology for high speed serial interface

  • Author

    Mi, Minhong ; Taliaferro, Steve ; Murugan, Rajen ; De Araujo, Daniel

  • Author_Institution
    Texas Instrum. Inc., Dallas, TX, USA
  • fYear
    2012
  • fDate
    13-16 May 2012
  • Firstpage
    11
  • Lastpage
    12
  • Abstract
    Skinny trace compensation is a simple yet effective technique for overcoming capacitive impedance discontinuities on high speed channels. This paper provides a comprehensive system-level modeling and analysis methodology for implementing this technique on high speed serial interface. System level simulation correlation to laboratory measurement for the HDMI (High Definition Multimedia Interface) interface on a real high speed low power mobile microprocessor SOC (System on Chip) design is presented.
  • Keywords
    compensation; microprocessor chips; system-on-chip; HDMI; capacitive impedance discontinuity; comprehensive system-level modeling; high definition multimedia interface; high speed channel; high speed serial interface; laboratory measurement; low power mobile microprocessor SOC design; low power mobile microprocessor system on chip design; skinny trace compensation methodology; system level simulation correlation; Abstracts; Loading;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal and Power Integrity (SPI), 2012 IEEE 16th Workshop on
  • Conference_Location
    Sorrento
  • Print_ISBN
    978-1-4673-1503-6
  • Type

    conf

  • DOI
    10.1109/SaPIW.2012.6222900
  • Filename
    6222900