DocumentCode :
2385175
Title :
Electrothermal reduced equivalents of highly integrated electronic systems with multi-port positive fraction foster expansion
Author :
d´Alessandro, Vincenzo ; de Magistris, M. ; Magnani, A. ; Rinaldi, Niccolo ; Russo, S.
Author_Institution :
Dipt. di Ing. Biomed., Elettron. e delle Telecomun., Univ. di Napoli FEDERICO II, Naples, Italy
fYear :
2012
fDate :
13-16 May 2012
Firstpage :
25
Lastpage :
28
Abstract :
An effective strategy is proposed for the extraction of reduced electrical equivalents of dynamic thermal models for electronic systems, based on well-established electrical macro-modeling techniques. Properly defined self-heating and mutual thermal impedances of the embedded active elements - preliminarily evaluated via 3-D thermal simulations - are reduced with passive identification methods, and equivalent electrical models are generated with a Foster multi-port synthesis. The technique is devised to determine a compact thermal feedback network, in a form well suited for commercial circuit simulation environments, thus allowing for a coupled electrothermal analysis.
Keywords :
circuit simulation; finite element analysis; network synthesis; 3D thermal FEM tool; 3D thermal simulations; Foster multiport synthesis; circuit simulation environments; compact thermal feedback network; coupled electrothermal analysis; dynamic thermal models; electrical macromodeling techniques; electrothermal reduced equivalent models; embedded active elements; equivalent electrical models; highly integrated electronic systems; multiport positive fraction foster expansion; mutual thermal impedances; passive identification methods; reduced electrical equivalent extraction; self-heating; Finite element methods; Heating; Random access memory; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Signal and Power Integrity (SPI), 2012 IEEE 16th Workshop on
Conference_Location :
Sorrento
Print_ISBN :
978-1-4673-1503-6
Type :
conf
DOI :
10.1109/SaPIW.2012.6222904
Filename :
6222904
Link To Document :
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