Signal integrity analysis of carbon-based on-chip nano-interconnects

Author

Chiariello, A.G. ; Maffucci, A. ; Mian, G.

Author_Institution

D.I.I., Second Univ. of Naples, Aversa, Italy

fYear

2012

fDate

13-16 May 2012

Firstpage

71

Lastpage

74

Abstract

The paper investigates the Signal Integrity performance of innovative on-chip interconnects made by carbon-based materials, such as Carbon Nanotubes (CNTs) and Graphene NanoRibbons (GNRs). The innovative solutions are compared to the conventional copper realization. A simple but physically meaningful equivalent circuital model is presented for these interconnects, which properly accounts for the quantistic and kinetic phenomena observed at nanoscale. The models also include effects of interconnect size and temperature. Using this model, a Signal Integrity analysis of the electrical performance of global level on-chip interconnects is carried out, referring to the 22nm technology node.

Keywords

carbon nanotubes; equivalent circuits; graphene; integrated circuit interconnections; C; CNT; GNR; carbon nanotubes; carbon-based on-chip nano-interconnects; copper realization; electrical performance; equivalent circuital model; global level on-chip interconnects; graphene nanoribbons; interconnect size effect; kinetic phenomena; quantistic phenomena; signal integrity analysis; size 22 nm; Abstracts; Metals; Nanoscale devices; Performance evaluation; Propagation losses; Reliability;

fLanguage

English

Publisher

ieee

Conference_Titel

Signal and Power Integrity (SPI), 2012 IEEE 16th Workshop on

Conference_Location

Sorrento

Print_ISBN

978-1-4673-1503-6

Type

conf

DOI

10.1109/SaPIW.2012.6222914

Filename

6222914