Abstract :
The 2006 International Conference on IC Design & Technology (ICICDT) conference provides an interdisciplinary forum where process engineers, device engineers and chip designers can exchange ideas, methodologies and results. We are pleased to recognize the support of the IEEE Central Texas Section, the Japan Society of Applied Physics and, for this year, also of STMicroelectronics and Tokyo Electron US Holdings. To continue to follow Moore??s law, new and tougher challenges must be solved. For example, from the technology side, the introduction of new materials, such as high-k, low-k, metal gates and magnetic materials poses formidable issues not only from the material management itself but also from the architectural point of view. On the other hand, power consumption management, leakage issues, reliability degradation and interconnection-related issues are the main challenges for the design community. In many cases, a satisfying solution to these problems can not be found within one single community, but these very complex issues can be solved only by collaboration among the different competencies of these communities. The 2006 ICICDT includes works on all these topics; the ultimate aim of the conference is that all experts of the various disciplines could interact in a relaxed but exciting environment.
