DocumentCode :
2386052
Title :
An HDSL chipset for high-speed transmission over copper
Author :
Essig, Daniel ; Lindenfelser, Tim ; Rokach, Ehud ; Liu, Wendy ; Lou, Perry ; Moran, Doug ; Seago, Brad
Author_Institution :
Brooktree Corp., San Diego, CA, USA
fYear :
1994
fDate :
1-5 May 1994
Firstpage :
461
Abstract :
High bit-rate digital subscriber line (HDSL) is an emerging technology that significantly simplifies the deployment of T1 and E1 data-rate services. With the use of adaptive equalization and echo cancellation techniques, HDSL technology eliminates the need for repeaters and line conditioning. This has enormous implications for the RBOCs and PTTs because of its potential to deliver T1 and E1 service quickly, reliably, and at a lower cost. Furthermore, HDSL technology is compatible with fiber. This comes at a time when everybody is talking about information super highways on fiber, but all these fiber super highways need off-ramps to the customer. The beauty of HDSL is that it takes advantage of the existing large installed base of copper, significantly boosting the bandwidth of the signal that can be transmitted in the “last mile” connection to the customer. A key milestone in realizing the true advantages of HDSL technology is the worldwide availability of low-cost VLSI chips. This paper describes the technical details of such a chipset
Keywords :
VLSI; adaptive equalisers; echo suppression; subscriber loops; twisted pair cables; Cu; E1 data-rate service; HDSL chipset; PTT; RBOC; T1 data rate service; VLSI chips; adaptive equalization; echo cancellation; high bit-rate digital subscriber line; high-speed transmission; information super highways; signal bandwidth; twisted copper wire; Adaptive equalizers; Availability; Bandwidth; Boosting; Copper; Costs; DSL; Echo cancellers; Repeaters; Road transportation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Communications, 1994. ICC '94, SUPERCOMM/ICC '94, Conference Record, 'Serving Humanity Through Communications.' IEEE International Conference on
Conference_Location :
New Orleans, LA
Print_ISBN :
0-7803-1825-0
Type :
conf
DOI :
10.1109/ICC.1994.368861
Filename :
368861
Link To Document :
بازگشت